Product

SCROLL
PCB Laser Cutting System
MLC 3000
With the MLC 3000 series, different power levels (depending on the thickness of the PCB) can be configured. The PCB panels can be loaded and unloaded manually. As a result of mechanical de-paneling's inherent mechanical stress, traditional mechanical de-paneling methods are not only noisy and dusty on the production floor, but tend to also increase the scrap rate, especially if the PCBs include sensitive components such as sensors.
Feature
  • UV / Green laser up to 20W
  • High peak power and short pulse width
  • Low HAZ at cut edge (cold cutting)
  • Excellent gaussian beam quality (M2<1.3)
  • Precise accuracy at +/-10um
Advantage
  • High cutting speed, high throughput
  • Cutting yield of >99.9%
  • Non-contact stress free process
  • Dual shuttle working