World Premiere · First Launch · 2027
Introducing XMLS.
XMLS is Laservall's neXt-generation Micro Laser Soldering platform, combining high-precision laser jet soldering hardware with a unified One Software Platform.
XMLS is Laservall's neXt-generation Micro Laser Soldering platform, combining high-precision laser jet soldering hardware with a unified One Software Platform.
This is the first launch of XMLS. XMLS has never been shipped, sold, or made available on any market prior to January 1, 2027. It debuts publicly for the first time on this page.
XMLS is a working prototype designed, engineered, and manufactured entirely by Laservall, and is offered under Laservall's own brand. It is not OEM/ODM, not supplied by a third party, and not a component. There are no known intellectual property conflicts relating to XMLS.
Current status: pre-launch — accepting pre-orders.
XMLS delivers superior precision, productivity, and flexibility while enabling faster customization and simplified maintenance through a modular architecture. Designed for advanced packaging, XMLS helps customers improve production efficiency today while accelerating future feature expansion.
Laser jet soldering at speeds of up to 9 shots per second.
Supports solder balls from 30 μm up to 2 mm.
A compact, all-in-one small bonding head with integrated AI process intelligence.
A standardized UI, modular architecture, and faster software customization.
Automatic nozzle contamination inspection, laser-to-nozzle alignment, and nozzle replacement.
Built-in temperature and laser power measurement.
| Name | XMLS — neXt-generation Micro Laser Soldering |
|---|---|
| Category | AI-driven micro laser soldering platform |
| Manufacturer | Laservall |
| Software | One Software Platform — standardized UI, modular architecture |
| First release | January 2027 (showcase) |
| Connectivity | Ethernet · LV Grid Cloud Platform · REST API |
| Safety | Class 1, CE certified |
| Applications | Wafer-level packaging (WLP) · Panel-level packaging (PLP) · IC package soldering · Camera module manufacturing · High-density & precision electronics manufacturing · Heat-sensitive electronic component soldering |
Specifications reflect the current prototype and may be refined before commercial release. XMLS has not been sold or shipped prior to January 1, 2027.